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Advancing EVs With Chip Embedding and Driver Tech

Advancing EVs With Chip Embedding and Driver Tech

This article features the electrical results obtained by a half-bridge board, which synergistically combines three technologies–Infineon’s…


Building a More Efficient DC-DC Converter: Efficiency Evaluation and Loss Analysis of a 300 W Isolated DC-DC Converter

Building a More Efficient DC-DC Converter: Efficiency Evaluation and Loss Analysis of a 300 W Isolated DC-DC Converter

This article focuses on determining the characteristics of the secondary-side MOSFET, necessary for achieving higher efficiency, and examines the…


SMPD: An Advanced Isolated Package To Keep the SiC MOSFET Chip Up to 75°C Cooler

SMPD: An Advanced Isolated Package To Keep the SiC MOSFET Chip Up to 75°C Cooler

The advanced isolated package from Littelfuse fills the gap between modules and discrete by offering the performance of a power module with the…


High-Power Next Core for Solar, Wind and Rail

High-Power Next Core for Solar, Wind and Rail

The High Power next Core module is the latest in Fuji's high-power portfolio, covering a range of industrial applications, predominantly for…


SiC Driver Modules for Next-gen Power Devices

SiC Driver Modules for Next-gen Power Devices

Learn more about the potential of SiC for your power designs.