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Thermomechanical Wear-Out in GaN Devices: A Focus on CSP and PQFN Packaging

Thermomechanical Wear-Out in GaN Devices: A Focus on CSP and PQFN Packaging

GaN power devices offer high efficiency, but reliability is now a package-level challenge. CTE mismatch causes solder-joint cracking, which EPC…

GaN power devices offer high efficiency, but reliability is now a package-level challenge. CTE mismatch causes solder-joint cracking, which EPC…

Industry Articles Jun 30, 2026 by Maurizio Di Paolo Emilio, EPC