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Thermomechanical Wear-Out in GaN Devices: A Focus on CSP and PQFN Packaging

Thermomechanical Wear-Out in GaN Devices: A Focus on CSP and PQFN Packaging

GaN power devices offer high efficiency, but reliability is now a package-level challenge. CTE mismatch causes solder-joint cracking, which EPC…


After the Flight: Why Drone Inspection Is Only Half the Job

After the Flight: Why Drone Inspection Is Only Half the Job

Maximizing the value of aerial PV inspections requires integrating thermal data into structured post-flight workflows, data prioritization, and…


Power System Reliability Modeling With In-Situ MTBF Calculations

Power System Reliability Modeling With In-Situ MTBF Calculations

This article explores how to get started with reliability modeling using a classical theory of assessing reliability for complex systems.