Vicor Corp. (Andover, MA) announced that it has entered into an agreement with Celestica Inc. (Toronto, Ontario) to manufacture and sell its V•I Chip (VIC) Product Family, which are the building blocks of the industry's new factorized power architecture (FPA).
The VICs process up to 240W of power in a small (<0.25in³) and light (<13g) ball-grid array package, with a power density of up to 960W/in³. The functional building blocks will be deployed as surface-mount device components to create flexible FPA systems.
"V•I Chips are a revolution in power conversion, and Celestica is excited to be at the forefront of this transition in the power marketplace," stated Chris Stratas, general manager, Celestica Power Systems. "Our deep engineering relationships with the world's leading OEMs will make V•I Chips and FPA easy and attractive to design-in for our customers. Our flexible, low-cost manufacturing offering will create an additional steady, secure source of supply."
"We are pleased that Celestica has become a licensee for V•I Chips," said Patrizio Vinciarelli, president and CEO of Vicor. "Celestica's reputation as a first-tier supplier of high-quality, power-conversion products, and its leadership in innovative electronics manufacturing services, qualifies it to become an excellent alternate source. We believe that this license will amplify the market opportunity and accelerate the market penetration of V•I chips and factorized power."