Universal Wireless Power Standard Accelerates Towards Completion: Part 1 of Qi Specifications Delivers on Key Interface Requirements
The Wireless Power Consortium announced that it has delivered the first part of the Qi interoperability specification to its members. Formally titled "System Description Wireless Power Transfer, Volume 1, Low Power, Part 1: Interface Definition, Version 1.00 Release Candidate 1", completion of Part 1 of the specification delivers the Consortium’s promise of compatible wireless power to manufacturers and consumers worldwide. It allows Consortium members to begin developing Qi-enabled products.
Part 1 of the Qi interoperability specification defines the interface between wireless charging stations and power receivers. The Consortium is now finalizing Part 2 (Performance Requirements) and Part 3 (Compliance Test Specification) to provide product developers with information essential for product certification. Compliance with all three parts is required for use of the Qi logo.
OEMs, ODMs, electronics brands and members of the portable electronics supply chain are invited to join the Consortium and contribute to the worldwide introduction of interoperable wireless charging. In the past three months the Consortium has doubled membership to more than 40 members across the consumer electronics value chain.
"This first part of Qi’s v 1.0 specifications sets the clock running on the introduction of consumer products that cut the last cord for a true simplicity in wireless lifestyle," said Camille Tang, President, ConvenientPower Limited and Chair, Wireless Power Consortium, Promotion Work Group. "Unlike proprietary non-standard wireless power charging products, the universal standard Qi provides certainty and confidence to consumers that their Qi-enabled electronic devices will be compatible with any Qi-branded charging device, regardless of manufacturer. For manufacturers, Qi offers a versatile range of receivers and transmitters, providing flexibility in design options as they plan their product roadmaps."
