TriQuint and Philips Sign Technology Agreement

February 24, 2002 by Jeff Shepard

TriQuint Semiconductor Inc. (Hillsboro, OR) and Philips Semiconductors (Sunnyvale, CA) signed a strategic partnership agreement that will allow Philips to access TriQuint's InGaP HBT 150mm wafer processing facilities. With the agreement, Philips will also gain access to TriQuint's IP for critical components in the PA and front-end modules that it designs and manufactures for mobile phones.

TriQuint and Philips said they intend to market their own products. The companies have already collaborated on a new W-CDMA PA module (BGY402) and PA/FE modules for GSM phones, which are currently available from Philips. TriQuint is also shipping PA products into the CDMA market. The companies said future development of advanced processes will focus on consumer applications for mobile communication markets.