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TAEC and Toshiba Offer Lead-Free Packaging

December 29, 2003 by Jeff Shepard

Toshiba America Electronic Components Inc. (TAEC, Japan and Irvine, CA) announced that many of its extensive line of power semiconductor package types will be manufactured using either lead-free packaging or lead-free finishes. To accommodate customers that are not making the transition to lead-free manufacturing, the company will continue to offer power semiconductor components in the original package finish.

Developed by Toshiba Corp. (Japan), the diverse line of power devices feature high-power IGBT modules and press packs, plus a comprehensive line of medium-power devices that include MOSFETs, bipolar transistors, Schottky barrier diodes, intelligent power modules, thyristors and triacs, and rectifiers. The high-power devices are optimized for industrial control applications, while the medium-power devices are targeted for use in portable applications.

Toshiba’s lead-free power devices are available with tin-silver or tin-copper lead-free plating that meet or exceed the requirements of the joint IPC/JEDEC standard J-STD-020B. The packaging is also compliant with European Union requirements, which take effect in 2005.