STMicroelectronics Inc. (ST, Geneva, Switzerland) and Siliconix Inc. (Santa Clara, CA), a subsidiary of Vishay Intertechnology Inc., announced that the two companies have concluded an agreement whereby ST will license from Siliconix a new power MOSFET packaging technology that provides thermal performance via top and bottom heat dissipation paths in systems using forced-air cooling.
Offered by Siliconix under the PolarPAK name, the new package's lead frame and plastic encapsulation are similar to those used for most standard power MOSFET packages, ensuring good die protection and easy handling in manufacturing. Compared with the standard SO-8, the PolarPAK package dissipates heat efficiently and can handle twice the current within the same footprint dimensions.
By delivering thermal performance and reducing package-related losses, the 5 mm x 6 mm PolarPAK package allows designers to create smaller, more compact circuit designs with a lower component count. With a height dimension of just 0.8 mm, half the height of the SO-8, the PolarPAK package enables end products that are thinner as well.
