Power Integrations Establishes Foundry Partnership With Epson

October 28, 2007 by Jeff Shepard

Power Integrations announced that it has established a foundry partnership with Seiko Epson Corp. ("Epson"). Qualification was completed during the third quarter of 2007, and production of Power Integrations’ high-voltage power-conversion ICs is now ramping at Epson’s wafer-fabrication facilities in Japan.

"Epson’s high-quality, cost-effective foundry makes them an ideal partner with which to implement our proprietary high-voltage manufacturing process," said John Tomlin, Power Integrations’ VP of Operations. "This partnership gives us production capacity to support the long-term growth of our business while helping us meet our cost-reduction goals."

According to Toshio Akahane, President and CEO of Epson Electronics America, "We are delighted that Power Integrations has selected Epson to produce its innovative power-conversion ICs. PI is a leading enabler in the effort to make electronic products more efficient, a priority that Epson shares. Both companies have worked diligently to move to the production stage, and we now look forward to a long-term wafer foundry relationship."