PMBus Sponsors Darnell’s Power China

March 08, 2012 by Jeff Shepard

Darnell Group Inc. has announced that PMBus™ is sponsoring the first-annual Darnell’s Power China (DPC ’12), to be hosted in Shanghai, May 15-16. DPC ’12 is an international event that focuses on “Solutions for Next-Generation Power Designs.” PMBus is the longest-continuous sponsor for Darnell’s Power Forum, hosted annually in Silicon Valley, California, and now PMBus is actively supporting the inaugural edition of Darnell’s Power China. Digital Power and Advanced Components are common threads in most areas of advanced power conversion and will be a key focus of Darnell’s Power China. DPC ’12 is broadly focused on power management, energy efficiency, advanced components, energy storage, smart grid innovations and more.

“PMBus has been involved with DPC’s sister event, Darnell’s Power Forum since it began 9 years ago. One of the first organizational meetings for the PMBus Organization took place at the inaugural DPF in 2004 and we have worked closely together ever since,” stated Jeff Shepard, President of Darnell Group. “Working with PMBus will enable DPC to give delegates access to the latest practical developments in next-generation power conversion technologies,” Shepard concluded.

Darnell’s Power China will feature several primary areas of focus: Advanced Components, Digital Power, Energy Harvesting, High-Efficiency Power Conversion, Developments in PwrSiP/PwrSoC Technologies and Innovations for the Smart Grid. Within each of these broad areas will be multiple topics and application areas. A call for papers has been issued for:

Advanced Components: Topics may include: Latest developments in power conversion components to support advanced designs such as, semiconductor devices, advanced packaging, interconnect, thermal management, magnetic devices, capacitors, batteries, ultracapacitors, sensors, new materials, integrated passives, and so on.

Digital Power: Topics may include: Technology-focused discussions including controllers and control loops, communications, power management, stability analysis, efficiency optimization, design tools, simulation and modeling, topologies, system partitioning between analog and digital, power quality and EMC, and so on.

High-Efficiency Power Conversion: Topics may include: High-frequency power conversion, high-temperature operation, power system-in-chip solutions, power system-in-package solutions, high-density packaging developments, optimizing converter efficiencies, new topologies, advanced (analog or digital) control techniques, parasitics, EMI/EMC considerations, and so on.

Innovations for the Smart Grid: Topics may include: Integration of distributed generation resources, micro grids, power systems communications, power quality, instrumentation and monitoring, enabling demand side management, supporting plug-in hybrid vehicles, large-scale energy storage, and so on.

PwrSiP/PwrSoC: Topics may include: miniaturization and integration of passive components, advances in high-frequency power conversion, new topologies and architectures, developments in packaging, multi-Megahertz switching, efficiency optimization, and so on.

In each case, the types of papers being sought include case studies and industry examples, design techniques and tools, and technology developments.