OnScreen Receives U.S. Patent for New Thermal Management Technology
OnScreen™ Technologies, Inc. announced that it has received a full grant of United States Letters Patent from the U.S. Patent and Trademark Office covering the company’s proprietary WayCool™ thermal management technology. The technology is claimed by the company to represent a major breakthrough in thermal management capabilities that increases performance and reliability while decreasing energy use in high-end electronic components.
The Letters Patent, from an application entitled "Cooling Systems Incorporating Heat Transfer Meshes," represents full patent coverage and associated protections of OnScreen’s WayCool-related intellectual property, providing for the use of meshes for cooling in a broad spectrum of applications. What the company describes as unique design elements, including the use of meshes, and the resulting functionality underlying the WayCool thermal cooling capabilities, has been proven to enable the efficient transfer of heat at extraordinarily high rates, thus promoting superior thermal management in high end electronic components.
William Clough, EVP of OnScreen Corporate Development, explains, "The issuance of this patent is a significant milestone in advancing our openly licensable thermal management IP company. OnScreen is designing the heat control technology that will lie at the heart of most advanced digital products." Clough continued that, "We are working closely to apply this technology in strategic applications with customers and partners such as OCZ Technology Group and ThermalTake Technology Co., Ltd, while engaging in new collaborative licensing and royalty opportunities with companies seeking viable thermal cooling solutions across a variety of markets."
Company CTO, Dr. Michael Schuette, commented that, "The issuance of this patent by the USPTO protects key elements of this breakthrough technology. We fully expect mesh-based heat transfer units to revolutionize the cooling process in electronics because of their higher efficiency and lower total cost of ownership compared with other cooling solutions currently available."
