INCEP Announces Agreement with Celestica

September 23, 2003 by Jeff Shepard

INCEP Technologies Inc. (San Diego, CA) announced that it has entered into a manufacturing agreement with Celestica. INCEP will leverage Celestica's operations in Asia, Europe and the Americas to provide its OEM customers with industry-leading quality, technology and supply chain management, enabling faster time-to-market, scalability and manufacturing efficiency.

INCEP is working with Celestica to help manufacture its new microprocessor power delivery modules, which combine the microprocessor die and its chip-carrier substrates with the microprocessor's power conditioning circuitry. This assembly is referred to as the ZVRM™ Assembly for computing applications.

The INCEP ZVRM dc/dc converter requires only a single heat-dissipating device and retention solution for the co-packaged microprocessor and power supply. INCEP has developed a patented approach of applying power to the surface of a microprocessor package, which supports traditional pin-grid array as well as land-grid array configurations. The solution also requires a high-performance power connector coupled with the high-density dc/dc converter, which combine to deliver the necessary device power.