IBM Microelectronics announced that it has scored a multi-year foundry agreement with Intersil Corp. (Milpitas, CA). The companies plan to install Intersil semiconductor process technology in IBM's Burlington, VT, manufacturing facility, with IBM serving as a second source manufacturer for Intersil's Endura power management ICs.
IBM plans to reserve capacity for Intersil's power management ICs manufactured in its P6 process, starting production in the first quarter of 2004. Over the life of the agreement, however, the companies stated that they may extend the partnership to cover additional processes, including potentially jointly developed processes.
