Emerson Announces Collaboration with Fluent to Improve Data Center Modeling

September 25, 2006 by Jeff Shepard

Emerson Network Power announced a collaboration with simulation software developer Fluent Inc. to help organizations better optimize data center airflow and reduce the risk of heat-related equipment failures. Fluent is a recently acquired and wholly-owned subsidiary of ANSYS, Inc., a global provider of simulation software and technologies designed to optimize product development processes.

Fluent will incorporate data on Liebert's precision cooling air conditioning units, including Liebert XDV and XDO supplemental cooling units, into CoolSim™ innovative software from Fluent. The CoolSim solution allows users to perform comprehensive cooling audits of data centers using computer-simulated airflow modeling. Emerson Network Power will also equip its Liebert application engineers with CoolSim. They will use the software to generate comprehensive cooling audit reports to help diagnose, troubleshoot and solve critical problems and recommend equipment that directly matches the needs of their customers.

"Businesses are continuing to install high-density servers that are creating heat loads that their current cooling systems weren't designed to handle," said Dave Kelley, Manager, Application Engineering, Liebert Precision Cooling at Emerson Network Power. "With CoolSim software from Fluent, we can provide greater visibility into existing conditions and more precisely configure solutions tailored to those conditions."

Kishor Khankari, CoolSim Project Manager at Fluent, added, "The Liebert XD products have emerged as very practical and flexible solutions to rising heat levels in data centers, and we are pleased that we have been able to integrate them into CoolSim. Now, CoolSim users can quickly and easily complete their cooling audit and, as a result, almost instantly pinpoint potential solutions to address any identified problems."

The Liebert XD was the first system, according to the company, to address the challenge of high density cooling. Cooling modules can be installed either on the top of the rack or in the ceiling and provide focused, high-efficiency cooling using a refrigerant rather than water. Cooling modules are connected to an overhead piping system and can be easily added or relocated using flexible tubing and quick-connect coupling.