Diodes Announces New Zener Diode Process

November 04, 2001 by Jeff Shepard

Diodes Inc. (Westlake Village, CA) announced the development of a breakthrough high-precision zener diode process. Diodes intends to use the new process to develop a line of subminiature, surface-mount zener devices.

FabTech Inc., a wholly owned subsidiary of Diodes, developed the new process, which surpasses the traditional method of high-temperature diffusion with a precision, high-velocity ion-implantation technique. Diodes plans to integrate the new zener diode technology into a wide range of company product lines, including sub-miniature SOT and SOD surface-mount packages that are currently manufactured by its mainland China facility.

"When we acquired the FabTech wafer foundry late last year, we saw it as a logical progression in building our company so as to become a total solution provider of discrete devices," said C.H. Chen, CEO of Diodes. "We also wanted to capitalize on the intellectual capital that existed within the FabTech research and development team, with the specific intention of accelerating the development and introduction of next-generation discrete technologies.”