C&D Technologies Win HP Development Award

August 30, 2005 by Jeff Shepard

The engineering team of C&D Technologies Inc. (Tucson, AZ) announced that it has received a development award from Hewlett Packard in recognition of development work carried out by its engineering team based in Portland, Oregon. The team received the award following its development of a high-complexity, high-density dc-dc converter to power Hewlett Packard's 64-bit, dual-core processors for enterprise servers.

The dual-chip packaging technology has been implemented in systems that enable Hewlett Packard to include twice as many processors as was previously possible. The technology means that two separate processors share the same data pathway connecting them to the rest of the computer.

The award was presented to C&D Technologies CPS Dan Enzone by Steve Rocha of Hewlett Packard. Enzone commented, "This award validates C&D's capabilities to develop power products that support industry-leading solutions for our customers. The development effort combined high-density packaging and an integrated thermal management system solution."