Adept Chosen as Automation Member of APIA

July 22, 2002 by Jeff Shepard

Adept Technology Inc. (San Jose, CA) announced that it has been chosen as the first wafer-handling, automation member of the Advanced Packaging and Interconnect Alliance (APIA), a global group of leading semiconductor equipment and process suppliers focused on accelerating the development and implementation of packaging solutions for leading-edge chipmakers worldwide.

"We are very excited about becoming a member of APIA and helping the alliance generate better and more timely solutions for the advanced packaging industry," said Joe Campbell, vice president of marketing for Adept Technology. "We look forward to leveraging our experience in wafer-handling and precision assembly to develop automation solutions for unique and evolving applications in advanced packaging."