EEPower

Vishay Offers New Siliconix N-Channel PowerPAK ChipFET MOSFETs


New Products Jan 14, 2007 by Jeff Shepard

Vishay Intertechnology, Inc. released eight n-channel power MOSFETs in an innovative new PowerPAK ChipFET package that offers advanced thermal performance in a compact 3mm by 1.8mm footprint. Featuring a broad variety of configurations and voltages, the new devices allow designers to easily replace larger power MOSFETs in a wide range of power-conversion applications.

As a space-saving alternative to MOSFETs in the much larger SO-8 package, the new PowerPAK ChipFET devices deliver higher power density by offering the same 3W maximum power dissipation with an 81% smaller footprint area and a 48 % thinner height profile (0.8 mm). For optimized design efficiency, n-channel power MOSFETs in Vishay's new PowerPAK ChipFET family are designed for point-of-load, synchronous rectification, and logic-level dc-dc conversion applications in low-power computer and fixed telecomm applications where space is at a premium.

N-channel PowerPAK ChipFET devices will also be used as load switches in portable electronic systems and notebook PCs, delivering footprint savings of 33%, a 23% thinner height profile, and a 9% reduction in on-resistance at a 4.5V gate drive compared with power MOSFETs in the TSOP-6. Among the eight new devices announced are single, dual, and single-plus-Schottky-diode power MOSFETs, with breakdown voltage ratings from 20 to 60V.

Single n-channel power MOSFETs in the PowerPAK ChipFET family are rated for typical thermal resistance values as low as 3°C/W (junction to case), with maximum on-resistance values as low as 0.015Ω in a 20V drain-to-source n-channel single-channel device and 0.039Ω in a dual-channel device. The single-plus-Schottky-diode power MOSFETs feature on-resistance values as low as 0.039Ω and Schottky diode forward voltage of 0.375V at 1A. All of these new PowerPAK ChipFET devices are pin-compatible with products in the standard ChipFET package.

Samples and production quantities of the new PowerPAK ChipFET devices are available now, with lead times of 12 to 14 weeks for larger orders. Pricing for U.S. delivery in 100,000-piece quantities starts at $0.20.