Vicor Adds B048K480T30 to V-I Chip BCM Family

Vicor Corp. (Andover, MA) announced the newest member of its V-I Chip Bus Converter Module (BCM) family, the B048K480T30, which provides 2,250 Vdc primary-to-secondary isolation with a unity transformation ratio (K = 1) over the input range of 38 Vdc to 55 Vdc. Rated for 300 W with an efficiency of 97 percent, the BCM sets new industry standards for power density and performance in Power-over-Ethernet (PoE) and Voice-over-IP (VoIP) applications and other applications requiring isolation from a 48 Vdc source.

The new V-I Chip offers a power density at 1,167 W/in³. It may be surface-mounted into the PCB with a profile as low as 0.16 in, for an effective power density of 1,750 W/in³, or on the board with an overall height of 0.25 in, for a power density of 1,095 W/in³. The V-I Chip power package is available with BGA or J-leads and is fully compatible with standard surface-mount manufacturing processes. The V-I Chip's high efficiency and thermally adept package enables the full 300 W capability to be realized at 65 °C, 300 LFM without a heatsink. With a 0.25 in high integral pin fin heatsink, full load is available at 75 °C, 200 LFM.

The B048K480T30 BCM is priced at less than $0.11/W in OEM quantities. Sample quantities are available now.