TI Introduces NexFET Power Block Devices in 3 x 3mm Package

Texas Instruments Inc. (TI) introduced a new NexFET Power Block device in a space-saving 3 x 3mm SON package. According to TI, the new CSD86330Q3D Power Block package achieves greater than 90% efficiency at 15A in half the area of competitive solutions that require two discrete power MOSFETs in 3 x 3mm QFN packages. According to the company, the Power Block has a significant advantage in power loss and output current capabilities over competitive solutions, and supports applications like servers, desktop and notebook PCs, networking equipment, cellular infrastructure, high-end consumer applications and merchant power supplies.

Key features and benefits of CSD86330Q3D Power Block include: 3- x 3-mm SON outline is half the size of two discrete MOSFETs in 3 x 3-mm QFN packages; improves efficiency with only a 35°C rise in temperature at 15 A with no airflow; high power density saves up to 10 mm² of board space; double frequency without increasing power loss reduces output filter size and cost versus competitive solutions; the SON package with an exposed grounded pad simplifies layout and improves thermal performance.

The NexFET Power Block is available in volume now from TI and its authorized distributors in a 3 x 3-mm SON package. Suggested resale pricing for the CSD86330Q3D is $0.95 in 1,000-unit quantities. Samples and evaluation modules are available.