New Industry Products

Sensor Development Kit for IoT with Lowest Power Bluetooth 5

February 14, 2019 by Scott McMahan

ON Semiconductor announced the introduction of the RSL10 Sensor Development Kit to give engineering teams a comprehensive platform for developing IoT applications with cutting-edge smart sensor technology. The company says that the kit uses the lowest power Bluetooth Low Energy radio.

Several applications including industrial wearables, asset monitoring, smart sensing solutions can be easily developed on this platform. Other applications using the platform include medical, gaming and PC, smart buildings and cities, home automation, and consumer electronics.

The RSL10 Sensor Development Kit combines the highly integrated RSL10 System-in-Package (RSL10 SIP) with a variety of advanced low power sensors from Bosch Sensortec including environmental, inertial (3-axis accelerometer, 3-asix gyroscope and a low-power smart hub for motion sensing), a geomagnetic sensor, and an ambient light sensor.

The development platform offers 9 degrees-of-freedom (DoF) detection and environmental monitoring, including temperature, ambient light, Volatile Organic Compounds (VOC), pressure, and relative humidity.

An ultra-low noise digital microphone is also included with the kit, along with a user-programmable RGB LED, 64Kbit of EEPROM, and three programmable push-button switches.

Commenting on the introduction of the RSL10 Sensor Development Kit, Dr. Peter Weigand, Vice President of Marketing, Bosch Sensortec, said, "We were excited to work with ON Semiconductor on the RSL10 Sensor Kit. This small form-factor platform includes Bosch Sensortec's highly integrated BME680 environmental sensor to detect a broad range of gases for air quality applications, as well as our BMM150 geomagnetic sensor and the BHI160 smart sensor for high accuracy motion sensing.

"The RSL10 Sensor Kit combines motion and environmental sensing with the ultra-low power capabilities of the Bluetooth 5 certified RSL10 to enable a new class of consumer and industrial IoT applications with improved sensor technology and longer battery life," Weigand said.

Example use cases and detailed documentation are provided in the CMSIS pack.

With the optional RSL10 Sense and Control mobile application, developers can connect to the RSL10 Sensor Development Kit to monitor sensors and to evaluate the kit's features (right out-of-the-box). The app also can upload sensor data to multiple commercial cloud platforms (AWS, IBM®, Azure ™, etc.).

Wiren Perera, who heads IoT at ON Semiconductor added, "The RSL10 Sensor Development Kit, enabled by the industry's lowest power Bluetooth Low Energy radio, will set the standard for ultra-low-power Bluetooth enabled smart sensor design. We are delighted to have the support of Bosch Sensortec in bringing the RSL10 Sensor Development Kit to market."

There are two variants of the RSL10 Sensor Platform:

  • RSL10-SENSE-GEVK (base version)
  • RSL10-SENSE-DB-GEVK (debug version)

Both variants ship with a CR2032 coin cell battery and a flexible NFC Antenna. On the debug (-DB) variant, the 10-pin debug header is populated and a Segger J-Link LITE CortexM debugger that connects to this header is also shipped. A needle connector (E.g.: TC2050 ) is required on the base variant for debugging.


  • Based on the RSL10 System-in-Package (SiP)
  • Bluetooth 5 certified
  • Certified to international wireless regulations (CE, IC, KC, MIC, FCC)
  • Configurable, low-power sensors
  • NOA1305 (Ambient light)
  • BHI160 (Integrated low-power smart hub, 3-axis accelerometer, 3-axis gyroscope)
  • BMM150 (Low-Power, Low-Noise 3-axis digital geomagnetic sensor)
  • BME680 (Integrated high-accuracy gas, pressure, humidity and temperature sensor)
  • INMP522 (Ultra-Low-Noise digital Microphone)
  • APTF1616 (Programmable RGB LED)
  • N24RF64 (64KB NFC EEPROM)
  • 3 programmable push-buttons
  • Supported by the RSL10 Sense and Control app (IoS®, Android™) for cloud connectivity

The RSL10 Sensor Development Kit is available now in a 5.5 mm2 WLCSP, a 6mm by 6mm QFN package, and a complete System-in-Package (SiP) with an integrated antenna.

ON Semiconductor invites attendees of Embedded World, February 26-28th, to visit its booth (Booth 260, Hall 4A).