Semikron Offers Modules With Pre-Applied Thermal Paste Layer

Semikron announced that it is offering its customers the option of ordering power modules with pre-applied thermal paste – described as a unique service that simplifies the customer’s assembly processes considerably, as the customer no longer needs to include this step in the production process. Furthermore, production staff do not come into contact with thermal paste, and thermal paste cannot accidentally be carried over into other areas of production. The homogonous thermal paste layers have the optimum thickness for the given module specifications, meaning there is less chance of DCB breakage.

The thermal paste is applied in an automatic screen printing process. "The application process is a high-precision process, guaranteeing a degree of precision of +/-10µm for module-specific thermal paste layers. Process control is done using Six Sigma QM methods and boasts a process capability of 1.33," explained Dr. Michaela Strube, Service Engineering Manager at Semikron. The optimum thickness of thermal paste layers means that development engineers can fully exploit module capabilities in terms of efficiency. Too much thermal paste would mean poorer thermal resistance, while too little would lead to thermal stress in the power electronic module, decreasing module durability and ultimately lifetime.

Modules with pre-applied thermal paste layers are transported in purpose-developed, patent-protected blister packaging that guarantees contact-free transportation. Power modules can be stored for up to 18 months in this type of packaging.

The service Pre-applied Thermal paste is currently available for MiniSKiiP modules. The extension of this service to additional modules is in progress.