New Industry Products

MORNSUN Adds to Fixed Input R4 Series with Chiplet SiP Technology

April 23, 2020 by MORNSUN

MORNSUN introduces a new addition to its R4 series reducing 80% of the dimension with chiplet SiP.

The MORNSUN DC-DC fixed input A/B/E/F_T-1W family grabs a good market share around the world for its advanced design, good performance, reliable manufacturing process, competitive price, and more Based on the end-use industry, such as portable equipment and IoT, DC-DC converters are expected to offer benefits in size, performance, reliability, and cost. MORNSUN released a new generation of fixed input R4 series with a major breakthrough in packaging technology by adopting the newest Chiplet SiP (System in Package) technology to achieve dimensions reduce 80% and save cost for the customer.

Picture 1: The History of Fixed Input
Picture 1: The History of Fixed Input


Breaking Through Restraint of Dimensions by Chiplet SiP

In order to achieve miniaturization of power supply module, when MORNSUN developed the R4 generation, both the concept of "embedded magnetic in PCB" and “Chiplet SiP technology” were taken into consideration, but after numerous reliability tests and verifications in some extreme application environments, the "embedded magnetic process in PCB" had long-term reliability risk. Comparing with "embedded magnetic PCB", the newest Chiplet SiP technology not only solves the miniaturization but also achieves better performance, so MORNSUN finally adopt technology to designing our new generation of fixed input R4 series.

The dimensions (LxWxH) of R4 has reduced by 80% and its layout space(LxW) also has reduced by more than 50%. The R4 generation comprehensive decoupling of the constraints among dimensions, appearance, surface mount packaging, high performance, and high reintegrates circuit technology, process technology, and material technology.


Picture 2: Advantages of R4 with Chiplet SiP
Picture 2: Advantages of R4 with Chiplet SiP


Chiplet SiP to Save Costs 

Through investigation, we know that more than 90% of the components on the PCB are assembled by SMD reflow soldering. While some input products with SIP package in the market also need to be installed on PCB boards by wave soldering. It will not only complicate the product manufacturing process (including the SMD reflow soldering process and wave soldering process), but also increase lead time, manufacturing costs, and the risk of quality. While the R4 generation is mounted on PCB through SMD reflow soldering without extra wave soldering process, which simplifies the production process and reduces the production costs.

Through insights into industry trends and an in-depth understanding of the market, MORNSUN is committed to technological innovation, upgrades, and best customer experience. Adhering to the principle of customer first, MORNSUN will develop more new products with g to meet more industry applications and customers' increasingly high requirements.



  1. 80% dimensions reduction, more than 50% layout space reduction, 3.1mm thickness
  2. Micro-SMD package
  3. Meet AEC-Q100
  4. Operating temperature range: -40℃~125℃
  5. ESD meets 8KV level (Contact)
  6. Continuous short-circuit protection
  7. Capacitive load:2400uF
  8. Isolation capacitance: 8pF
  9. I/O isolation test voltage: 3000 VDC