Modules in 62-mm Package Enable Higher Power Density

Infineon Technologies AG is expanding its offering of 62-mm IGBT modules. The new power modules serve the growing demand for higher power density without increasing package size. This is realized by a larger chip area and an adapted DCB substrate in the proven 62-mm package. Typical applications for modules with 1200V blocking voltage are drives, solar inverters and uninterruptible power supply (UPS) as well as medium-voltage drives for modules with 1700V blocking voltage.

With a blocking voltage of 1200V, the 62-mm module reaches a maximum current rating of 600A. At 1700V blocking voltage, the maximum current rating is 500A, making Infineon the market leader for this rating. The package is equipped with a base plate, its size corresponds to the industrial standard. It can therefore easily be integrated into existing designs delivering, for example, 20 percent more output power when applied for drives. The portfolio uses the IGBT4 – a proven technology that offers high robustness and reliability.

Two versions of the new power modules are also available in the “common emitter” configuration, with which a 3-level topology (NPC2) can be set up. This allows an efficient use in solar and UPS applications where the demand for power is high.

The new 62-mm power modules are in volume production, they are also available with pre-applied thermal interface material (TIM). Resembling a perfect match for the new 62-mm modules, Infineon also offers new thyristor / diode modules for the input rectifier in 34-mm and 50-mm packages featuring solder bonding technology.