EEPower

Fairchild P-Channel PowerTrench WL-CSP MOSFETs Minimize Board Space in Mobile Applications


New Products May 15, 2012 by Jeff Shepard

Fairchild Semiconductor has introduced the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench® Thin 0.8 x 0.8mm WL-CSP MOSFETs.

Using a state-of-the-art "fine pitch," thin WL-CSP packaging process, these devices minimize board space and RDS(ON), while achieving excellent thermal characteristics for a miniature form factor.

Features include:

-- Very small (0.8 x 0.8mm) packaging occupies only 0.64mm2 of PCB area, less than 16% of the area of a 2mm x 2mm CSP

-- Ultra-low profile is less than 0.4mm height when mounted to PCB

-- Low RDS(ON) ratings with VGS as low as -1.5V

-- Excellent thermal characteristics (RΘJA of 93ºC/W, on 1in2 2oz copper pad)

-- RoHS-compliant

-- Suitable for use in battery management and load switch functions in mobile applications

The devices are price (in 1,000 quantity pieces) as follows: FDZ661PZ at $0.26; FDZ663P at $0.26; with a delivery of 8-12 weeks ARO.