New Industry Products

ERNI Unveils New MicroSpeed Power Module Series

November 21, 2006 by Jeff Shepard

ERNI Electonics announced the introduction of its new MicroSpeed™ Power Modules. This complementary range of Power Module connectors, with 2.0mm contact pitch, fulfils the need for miniaturized and high reliability power systems, and offers a large number of options for mezzanine applications. One of its unique features is its high current-carrying capacity in comparison to its small size. Based on a special contact material, the connector system achieves up to 6-8A at 20°C. Therefore, the system is well-suited for use with small, high performance devices such as CPUs, drives, LCD panels, etc.

Providing a variety of height versions of the male (1, 2, 9 and 10mm) and female (4, 6, 8 and 10mm) connectors, the Power Module series enables stacking heights from 5mm to 20mm. Subsequently, almost every need for different PCB arrangements can be addressed. Another major advantage is the multiple-connector mating capability, which allows the mating of more than one connector pair at the same time. The SMT connectors meet all the needs of fast automatic assembly machines. They are manufactured and 100% inline quality checked by machine to ensure high co-planarity and optimized soldering. The layout is designed with an optimal solder pad size to guarantee high retention forces. The integrated 3-point double beam female contact ensures durable low-contact resistance over the whole lifecycle.

The Microspeed Power Modules use pins with SMT termination. For the shield metal sheet, two termination options are available: SMT for standard applications, and THR shield pins with high retention forces for harsh environments. In addition, maximum wipe length is guaranteed within the smallest board-to-board distance. The contacts are post plated, leaving no bare edges in the contact and solder areas. The connectors are equipped with polarized positioning pegs, and the connector plating is lead free, complying with the European RoHS directive. The MicroSpeed Power Modules are specified for a temperature range of -55°C to +125°C.