Dialog Semi and TDK Create the First Single-Integrated Point-of-Load Power Supply
Dialog Semiconductor and TDK Corporation look to solve the challenge of high peak current demands and low noise margins, required by high-performance semiconductors by placing individual power supply regulators.
Dialog Semiconductor a leading provider of power management, AC/DC power conversion, Wi-Fi, and Bluetooth low energy technology. In late July, Dialog announced a collaboration with TDK Corporation, a global leader in electronic solutions for the smart society, on creating the world’s first single-integrated system power sequencing solution.
Image courtesy of Dialog Semiconductor.
Dialog’s Configurable Mixed Signal IC, GreenPAK
GreenPAK power solutions are cost-effective multi programmable non-volatile memory devices that allow design engineers to customize and program custom ICs. GreenPAK implements a number of functions such as; finite state machines, timing delays, power switching, and voltage monitoring.
The block diagram for a GreenPAK product, ‘SLG46108’ which is commonly used for data communications equipment and handheld electronics. Image used courtesy of Dialog Semiconductor.
One of GreenPAK’s power solutions is the SLG46108, which provides a small, low power component for commonly used mixed-signal functions. The user creates their circuit design by programming the one time Non-Volatile Memory (NVM) to configure the interconnect logic, the I/O Pins, and the macrocells of the module. This highly versatile device allows a wide variety of mixed-signal functions to be designed within a very small, low power single integrated circuit.
GreenPAK products feature logic and mixed-signal circuits, highly versatile macrocells, and up to a 5V power supply. A simple solution is programmable through without needing a specific coding language or compiler to customize.
TDK’s Embedded DC-DC Converter, µPOL
TDK’s latest series of µPOL power solutions. These new solutions incorporate high-performance semiconductors in advanced packaging technologies such as semiconductor embedded in a substrate (SESUB) and advanced electronic components to achieve unique system integration in a smaller size and lower profile by 3D integration. This is designed to power modern microprocessors, microcontroller, ASIC, FPGA, DSP, and advanced digital logic devices.
A DC-DC converter designed to power modern microprocessors, microcontroller, ASIC, FPGA, DSP, and advanced digital logic devices. Image used courtesy of TDK Corporation.
The increasing demand for high performance, fast load transient and voltage accuracy in a small footprint is the driving factor for this new innovation. TDK’s μPOL technology offers an integrated compact solution and with its I2C communication, the device is configurable for a vast range of applications.
This is a wide input range, a non-isolated step-down converter, the output voltage can be configured from 0.6V to 5V using serial communication (I2C) without a need for any external components. The Stability of the converter is ensured internally, thus no need for external compensation. Lots of design efforts have been made in order to make this device easy to use, system designers need to only add input and output capacitors to have a complete DC-DC converter.
GreenPAK & µPOL: A Power Sequencing Solution
Traditional discrete solutions that are currently available in the market require an extensive array of components, which reduces board space availability, impacts system reliability, and drives up overall costs. Most are only capable of generating lower than the input voltage while adding high power dissipation. Combining Dialog’s GreenPAK technology with TDK‘s small, high-density power module reduces the number of required components and ensures a more compact, robust solution for powering advanced industrial embedded control, IoT, and 5G applications.
The µPOL solution from TDK leverages the combined device to incorporate semiconductor embedded in a substrate, for cohesive 3D system integration in a smaller size and lower profile. This integration allows TDK to deliver higher power density and ease of use at a lower total system cost. A good example to reference is TDK’s power solutions, such as the FS1406, which offers a high-density solution for space-constrained applications requiring a low-profile power source at 3.3 x 3.3 x 1.5 mm.
“Our µPOL micro embedded DC/DC converter enables miniaturization and drives power density alongside Dialog’s compact power sequencer, bringing ease of use and lower total cost of ownership to our customers,” said Parviz Parto, President Faraday Semi, a TDK Group Company.
Davin Lee, SVP & General Manager of Advanced Mixed-Signal Business Group at Dialog Semiconductor added, “By working alongside TDK, we combined the flexibility, programmability, and scalability of our GreenPAK technology with the industry’s most compact and highest power density point-of-load solutions from TDK into a single chipset.”
Most popular switching regulators are based on magnetic elements, however, the switched capacitor regulator is often used in low current portable applications where the current requirement is less than approximately 200 mA. With TDK and Dialog’s POL power supply, designers are provided with a reliable, efficient, customizable, and fully integrated device that delivers a new solution to an old problem.