BI Releases Thin H-Bridge Module

BI Technologies recently released a compact and cost-effective H-bridge IGBT power module that provides ultrafast diodes and significant space savings for motor drivers, switch-mode power conversion, high-power audio amplifiers and UPS systems. Designated the 7721 Series, these power components are claimed to be the thinnest modules available on the market (.200 inches) and are offered in 500volt/22Amp or 600volt/32amp configurations. This module also features internal temperature sensing for fast response to thermal overload.

"The 7721 H-bridge enables design engineers to save valuable board space and assembly time," explained Robert Mosso, engineering manager for BI Technologies’ Electronic Components Division. "This advanced design replaces up to eight TO-220 or TO-247 discrete power semiconductors, therefore significantly reducing costs while preserving board real estate."

The 7721 Series module easily fits between the PC board and heatsink and is half the height of similar products on the market, according to Mosso.

Standard configurations for the H-bridge module include the 7721-1A, featuring 22A 500V IGBTs with 8A 600V ultrafast diodes; and the 7721-2A, featuring 32A 600V IGBTs with 25A 600V hyperfast diodes. Custom versions of the H-bridge module are also available to meet the needs of specific applications. The design accepts any IGBTs or FETs with parallel diodes up to size 5.

The module measures 2.230 inches in length and 1.380 inches wide with a height of .200 inches. Typical operating temperatures range from -40º to 125ºC.

Typical pricing for the 7721-H-bridge module 1A (22A/500V) is $25.46 each in quantities of 5000 and the 2A (32A/600V) is $34.82 each in the same quantities.