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Tessera Signs MOU to Settle Litigation with Samsung

November 15, 2004 by Jeff Shepard

Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced that it has signed a memorandum of understanding with Samsung Electronics. This memorandum of understanding contemplates that Tessera and Samsung will execute a definitive agreement providing for settlement of the ongoing lawsuit between the two companies.