Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced that it has signed an agreement that expands the license terms of the existing agreement with Sharp Corp., a leading consumer electronics company. Sharp utilizes Tessera's technology to package many types of semiconductor devices, and incorporates the semiconductors into a variety of consumer products, including personal digital assistants, digital still cameras, video cameras and mobile handsets.
The technology available to Sharp under the expanded agreement covers a broad range of chip-scale and multi-chip package types, including integrated circuit devices packaged in "face-down," "face-up," "fold-over," "stacked," and "system-in-package" formats, utilizing many different types of materials, including packages using either tape or laminate substrates. Under the expanded agreement between the companies, Tessera's technology is available for use by both Sharp and its subcontractors.
