Samsung Electronics Co. Ltd. (Seoul, Korea) announced the development of a 1Gb, double data rate (DDR), SDRAM, die-stack, chip-scale package (CSP) that offers two 512Mb DDR SDRAM dies in a single package. The new package solution doubles memory density and at the same time, resolves the design constraints of mobile applications and high-performance servers that require higher memory capacity in a small footprint.
Samsung's DDR CSP is available in DDR 266 and DDR 333 versions and measures just 11.5mm x 12mm. It meets the JEDEC DDR CSP ball pitch specifications (0.8mm/1.0mm) and can be used in a wide range of products that currently use DDR CSP devices. By vertically stacking two dies in a single package, the CSP solution will boost the performance and efficiencies of high-end applications with tight space targets. Taking this packaging concept one step further, 2Gb DDR CSPs can be achieved by utilizing 1Gb DDR SDRAM dies.
