Tyco MINIPAK HDL Connector Combines High-Density, Low-Profile, & Mateability
Tyco Electronics provides the MINIPAK HDL connector designed to provide 20 percent more current density in a smaller package than comparable products currently offered in the market. The product offers a high density power interface in a blind-mateable, co-planar board-to-board connector that stands only 8mm off the edge of the printed circuit board (PCB).
The MINIPAK HDL connector consists of a right-angle plug and receptacle that utilizes an eye-of-the-needle tail for use in both solder and press-fit applications. The product is fully qualified to end-of-life conditions and produces a current rating of 17A per contact, with eight adjacent contacts all carrying 17A.
"Our MINIPAK HDL product matches the performance and scalability of the previous de-facto standard Multi-Beam XL product, yet it is approximately 35% less in height – resulting in improved cooling efficiencies in compact 1U power supply designs," said Mike Blanchfield, Global Team Leader.
The connector, manufactured on a mass-customizable platform, allows customers to select a wide array of configurations and layouts without up-front tooling charges. The UL-recognized connector also contains three levels of mating sequences to suit hot-swap applications -- specifically modular hot-swappable power distribution systems. Product applications include 1U servers, high-end servers, and telecommunications switches.
