SiC MOSFET Power Modules for Automotive Applications

HPD series are 1200 V three-phase water-cooled SiC MOSFET power modules in industry-recognized automotive footprint, which are optimized for traction inverters and motor drives. To deliver automotive-grade HPD SiC power modules Leapers Semiconductor uses its patented Arcbonding™ technology (figure 2).

Unlike traditional Al wire bonding technology used by many manufacturers of automotive-grade power semiconductors, Arcbonding™ patented chip surface connecting technology ensures the reliability of SiC modules reaching automotive application requirements, while significantly reducing parasitic resistance and parasitic inductance. Besides, Arcbonding™ proved to significantly reduce static losses, improve power cycling, and the ability of short-time impulse current.

 

Figure 1. HPD Series SiC Power Modules. Image used courtesy of Bodo’s Power Systems

 

Figure 2. Leapers Semiconductor’s Patented ArcbondingTM Technology. Image used courtesy of Bodo’s Power Systems

 

In the HPD series, Leapers Semiconductor uses silver sintering for die-attach, high-grade Si3N4 AMB substrates for higher thermal performance and robustness, and highly reliable epoxy resin potting technology. All this leads to:

• optimized internal low stray inductance and Arcbonding™ structure, significantly improved dynamic switching performance;
• 20-30% higher power density than modules from major competitors;
• lower thermal resistance.

 

Voltage (V)	Part Number	Current (A)	Rdson (mΩ)
1200	DFS04FB12HDW1	400	4.25
	DFS03FB12HDW1	600	2.8
	DFS02FB12HDW1	800	2.1
	DFS04FB12HDB1	400	3.35
	DFS03FB12HDB1	600	2.2
	DFS02FB12HDB1	800	1.7

 

Leapers Semiconductor’s HPD series SiC power modules deliver performance for xEV applications. Thus, design engineers can expect to:

• have high power density for reduction of system size;
• provide increased power efficiency;
• increase battery utilization efficiency.

Leapers Semiconductor offers HPD series modules in Full-Bridge topology which cover power requirements of 150 kW to 400 kW.

Through its technological innovations for the automotive industry, Leapers Semiconductor aims to move humanity forward to a better and greener future. Leapers Semiconductor’s SiC product portfolio including HPD series power modules responds to all requirements set by the xEV manufacturers, and together with its partners, Leapers Semiconductor will contribute to reaching the target set to face the global challenges, especially driving modern society to a carbon-free future.

 

This article originally appeared in Bodo’s Power Systems magazine.