KEMET Offers Flex-Robust Large Case Size Ceramic Chips To Reduce Cracking

KEMET Corp. announced that it now offers Flexible Termination (FT-CAP) in case sizes 1808 thru 2225 in X7R dielectric.

"Larger case size ceramic chips can be vulnerable to cracking due to shear stresses that may be produced during board assembly and handling. The flexible termination solution now offered by KEMET on our larger case size MLCC’s minimizes cracking during product assembly and adds to our flexible termination portfolio," stated Corey Antoniades, Associate Technical Marketing Manager for KEMET. "This has been an issue in the past, so these new products offer our customers a valuable flex mitigation solution."

Flexible terminations add pliability to the end termination, minimizing the transfer of board flex stress to the component body. The FT-CAP is a surface mount multi-layer ceramic capacitor that incorporates a unique and flexible termination system. Integrated with KEMET’s standard termination materials, a conductive epoxy is placed between the conductive metallization and nickel barrier finish establishing pliability while maintaining terminal strength, solderability and electrical performance. This technology directs board flex stress away from the ceramic body and into the termination area. As a result, this termination system mitigates the risk of low-IR or short-circuit failures associated with component cracking due to board flex.

The FT-CAP is said to complement KEMET’s "Open Mode," "Floating Electrode (FE-CAP)" and "Flexible Termination w/Floating Electrode (FF-CAP)" product lines by providing a complete portfolio of flex solutions.