New Industry Products

IR Releases Family of 25 & 30V Performance PQFN Power MOSFETs for Industrial PoL Applications

November 11, 2010 by Jeff Shepard

International Rectifier (IR)® announced the introduction of a family of 25 and 30V devices featuring IR’s latest HEXFET® MOSFET silicon in a new performance PQFN 3 x 3 package that delivers a high density, reliable and efficient solution for dc-dc converters in telecom, netcom, and high-end desktop and notebook computer applications.

As a result of improved manufacturing technology, IR’s new performance PQFN 3 x 3 package enables up to 60% higher load current capability than standard PQFN 3 x 3 devices in the new compact footprint while overall package resistance is significantly reduced to deliver extremely low on-state resistance (RDS(on)). In addition to the low RDS(on), the new performance PQFN package offers enhanced thermal conductivity as well as improved reliability and is qualified to industrial standard and moisture sensitivity level 1 (MSL1).

The performance PQFN package technology is also applied to 5 x 6mm footprint devices enabling designs requiring more current without the need for additional footprint compared to standard PQFN 5 x 6 devices.

The family includes devices optimized for use as control MOSFETs featuring low gate resistance (Rg) to reduce switching losses. For synchronous MOSFET use, devices are available as a FETKY® (monolithic FET and Schottky diode) configuration to offer enhanced efficiency and EMI performance by reducing reverse recovery time.

"The new family of performance PQFN package devices offers a high density, highly reliable and flexible solution optimized for dc-dc applications. Moreover, by expanding IR’s PQFN offering, customers can now select from many package combinations to achieve the optimal result for their design," said George Feng, Marketing Engineer for IR’s Power Management Devices Business Unit.

Pricing for the IRFHM830D begins at US $0.43 each in 10,000-unit quantities. Production orders are available immediately.