Indium Corporation Launches New Water-Soluble Halogen-Free Solder Paste

Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications. 

Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest voids, a reduction in the size of the largest voids, and minimized overall voiding. 

Other Indium6.6HF benefits include:

• Halogen-free per IEC 61249-2-21 test method EN14582
• Exceptional printing process window:
  • High transfer efficiency
  • Long stencil life (up to 12 hours)
  • Excellent response-to-pause
  • Prints consistently at a wide range of speeds
• High tack value (>8 hours) ensures consistent component holding power, allowing high-speed component placement operation
• Cleanable up to at least 72 hours after reflow

About Indium

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.