Indium Corporation Introduces Non-Silicone Based TIM for Burnin and Test
This article highlights Indium Corporation Non-Silicone-Based line of thermal interface materials (TIMs) designed for burn-in and test applications.
Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material designed for burn-in and test applications.
HSMF-OS is designed for high insertion capability. Its high tensile strength and soft compliant polymer backing allow it to survive multiple insertions. HSMF-OS has been tested to withstand over 5,000 insertion cycles without any loss of performance.
One of the challenges associated with a burn-in TIM is the attachment method. HSMF-OS has inherent adhesive properties on one side that allow for hand placement, removing the need for these additional steps and fixtures without compromising thermal performance. The opposite side is aluminum and it will not mark or stain the DUI (device under test).
HSMF-OS offers consistently good performance without phase change.
For more information on HSMF-OS and Indium Corporation’s full line of TIMs, visit Indium TIMs
About Indium Corporation
Indium Corporation is a premier manufacturer and supplier of advanced materials for the global electronics, semiconductor, think-film, and thermal management industries. We develop, manufacture, and market solders; electronics assembly and packaging materials; pure indium, gallium, germanium, and tin, as well as alloys, inorganic compounds, and a closed-loop reclaim system.
