CPS Announces AlSiC Metal Matrix Composite Lids For AMC & MictroTCA Assemblies

CPS Technologies Corp., a designer and producer of metal matrix composites addressing thermal management and structural reliability, released its AlSiC (Aluminum Silicon Carbide) metal matrix composite lids for Systems in Package (SiP) IC approaches for ATCA, Advanced Mezzanine Cards (AMC), and MicroTCA assemblies.

The SiP technology combines multiple die with multiple functionalities into a single package including components usually found on mother boards to create what is described as highly integrated products for optimized cost, size and performance. AlSiC states that its "unique set of material properties and fabrication approaches provide an ideal packaging solution for SiP and offers exceptional design capability for larger multifunctional systems."

The AlSiC provides thermal management with device compatible thermal expansion coefficient (TCE) for reduced thermally induced stresses due to differential TCE of device and assembled materials. The AlSiC material’s high thermal conductivity value is said to offer efficient thermal dissipation. It is claimed that TCE compatibility and good thermal dissipation improve reliability in SiP approaches by reducing assembly bowing and flexing that can lead to delamination, solder ball or die failure.

The AlSiC is a lightweight material with a density 1/3 that of Cu, which is said to significantly reduce the weight per solder ball, improving assembly yield and improving a product’s in service vibration tolerance. The lightweight nature of AlSiC means less restrictive orientation requirements for larger lid structures. The strength and stiffness is greater that Cu by 1/3. Larger lid packaging can be considered because of the higher stiffness and lower density of AlSiC.

The CPS AlSiC net-shape casting fabrication process both produces the composite material and product shape in one process step, which is said to result in a cost-effective product with greater geometrical capability than stamped Cu lid solutions. The geometrical capability of this casting process enables functional design features such as pockets for memory chips, capacitors, and resistors, as well as cavities or pedestals for the die. The depth of these features is tightly controlled to minimize the bond length thickness and assembly and thermal dissipation variability between assemblies.

The AlSiC cast surface supports various identification methods including, laser marking, paint, ink, and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum.

The AlSiC meets the requirements of the Restriction of Hazardous Substances Directive (RoHS compliant) of the European Parliament.