Tech Insights

December 2014 Electronics Industry Digest

December 03, 2014 by Aubrey Dunford

Makers and startups, not tech providers, consumer goods companies or enterprises, will drive acceptance, use and growth in the Internet of Things (IoT)

Makers and startups, not tech providers, consumer goods companies or enterprises, will drive acceptance, use and growth in the Internet of Things (IoT) through the creation of a multitude of niche applications, so Gartner. Gartner predicts that by 2017, 50 percent of IoT solutions (typically a product combined with a service) will originate in startups that are less than three years old. Individuals and small companies that span the globe are developing IoT solutions to real-world, often niche problems. They are taking advantage of low-cost electronics, traditional manufacturing and 3D printing tools, and open-and closed-source hardware and software to create IoT devices that improve processes and lives, says Gartner.



Measured in euros, European semiconductor sales were € 2.393 billion in August 2014, a 0.4 percent decrease over July and an increase of 8.3 percent versus August 2013, so the WSTS. On a YTD basis, semiconductor sales increased by 6.1 percent in euros versus the same period in 2013.

Microchip Technology, a provider of microcontroller, mixed signal, analog and Flash-IP solutions, warned that its quarterly sales would be about 3 percent below its expectations. Samsung Electronics announced a plan to construct a new semiconductor fabrication plant in the company’s Godeok Industrial Complex in Pyeongtaek to meet growing demand for advanced semiconductor products. Construction on the 790,000m2 site will begin during the first half of 2015, and operations are scheduled to begin sometime during the second half of 2017.

China has implemented national policies to expedite the development of its domestic IC design and semiconductor manufacturing. Taiwanese semiconductor foundry UMC will participate in a joint venture company focused on 12” wafer foundry services with Xiamen Municipal People’s Government and FuJian Electronics & Information Group.

Worldwide semiconductor capital spending is projected to total $ 64.5 billion in 2014, an increase of 11.4 percent from 2013, so Gartner. Equipment spending will increase 17.1 percent, at $ 39.2 billion, as manufacturers pull back on new fab construction and concentrate on ramping up new capacity instead.



Toyoda Gosei and Osram have extended their agreement which allows the companies to use each other’s patents for specific light emitting diode, including white LED, and laser technologies. The original agreement of 2007 allowed both Osram and Toyoda Gosei significantly more freedom to develop, manufacture and market new products without fear of unintentional violations of patents. By facilitating research at both companies, new developments in LED technology were enabled, including an acceleration of research to improve the luminosity of LEDs. The new agreement extends the scope of the patents covered by the original 2007 agreement, to include patents filed after the execution of the original agreement.


Passive Components

TE Connectivity has completed the previously announced acquisition of Measurement Specialties, a supplier of sensor technologies including pressure, vibration, force, temperature, humidity, ultrasonics, position and fluid, for a wide range of applications and industries. The acquisition of Measurement Specialties for approximately $ 1.7 billion, expands TE’s sensor business significantly, and builds on their strength in harsh environment applications. Measurement Specialties will be included as part of TE’s Transportation Solutions segment.

Germany’s total PCB revenues in August recorded its highest sales since the pre-crisis year of 2008, so the ZVEI. Total sales went up by 3.1 percent in August year-on-year. Cumulative sales from January to August were up by 2.9 percent compared to the same period last year. In terms of incoming orders, August 2014 figures were up by 13 percent from last year. Cumulative sales from January to August were up by 2.9 percent compared to the same period last year. Cumulative orders from January to August were up by 10.3 percent compared to the same period last year. Book-to-bill ratio fell back to 0.98.


Other Components

The Electronic Design Automation (EDA) industry revenue increased 6.3 percent for Q2 2014 to $ 1757.9 M, compared to $ 1653.4 M in Q213, so the EDA Consortium. Sequential EDA revenue for Q214 increased 0.7 percent compared to Q114, while the four-quarters moving average, which compares the most recent four quarters to the prior four quarters, increased by 5.8 percent.

Three power supply manufacturers announced the formation of a new power industry consortium, the Architects of Modern Power (AMP). The founding members are CUI, Ericsson Power Modules and Murata – all global players developing advanced power conversion technology for distributed power architectures. The aim of the alliance is to create the most technically advanced, end-to-end distributed power solutions – a complete ecosystem of hardware, software and support. This summer, Alpha opened its new Die Attach Applications Center in Langenfeld, Germany, dedicated to serving the requirements of the LED/optoelectronics and power semiconductor markets. This facility offers opportunities for European and other global companies to run their assemblies on the latest die attach equipment using advanced Alpha sintering, soldering, and polymer technologies.



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This is the comprehensive power related extract from the «Electronics Industry Digest», the successor of The Lennox Report. For a full subscription of the report contact: [email protected] or by fax 44/1494 563503


About the Author

Aubrey Dunford is the change specialist of Europartners. His major area of interest lies in helping companies face up to essential change, particularly in managing the interface between sales/marketing and manufacturing. He also runs DEO Consulting Ltd. as a UK management consultancy which gives him exposure to industries outside the electronics industry.


This article originally appeared in the Bodo’s Power Systems magazine.