SEMI Releases 13 New Semiconductor Standards
Semiconductor Equipment and Materials International (SEMI) published 13 new technical standards relating to semiconductor and flat panel display manufacturing. The new standards were developed by equipment suppliers, device manufacturers and other companies participating in the SEMI International Standards Program.
Included in the new standards are best practices for welding of fluid distribution systems in wafer fabs, provisional specifications for XML message structures, guidelines for calculating overall factory efficiency, and measurement methods for optical characteristics of flat panel display backlight units.
The new standards include: SEMI D33-0703: Measuring Method of Optical Characteristics for Backlight Unit; SEMI D34-0703: Test Method for Measurement of FPD Polarizing Films; SEMI E122.1-0703: Specification for SECS-II Protocol for Tester-Specific Equipment Model; SEMI E123.1-0703: Specification for SECS-II Protocol for Handler-Specific Equipment Model; SEMI E124-0703: Provisional Guideline for Definition and Calculation of Overall Factory Efficiency and Other Associated Factory-Level Productivity Metrics; SEMI E125-0703: Provisional Specification for Equipment Self Description; SEMI E126-0703: Provisional Specification for Equipment Quality Information Parameters; SEMI E127-0703: Specification for Integrated Measurement Module Communications: Concepts, Behavior, and Services Table of Contents; SEMI E128-0703: Provisional Specification for XML Message Structures; SEMI F77-0703: Test Method for Electrochemical Critical Pitting Temperature Testing of Alloy Surfaces Used in Corrosive Gas Systems; SEMI F78-0703: Practice for Gas Tungsten Arc (GTA) Welding of Fluid Distribution Systems in Semiconductor Manufacturing Applications; SEMI F79-0703: Guideline for Gas Compatibility with Silicon Used in Gas Distribution Components; and SEMI M23.6-0703: Specification for Round 150mm Polished Monocrystalline Indium Phosphide Wafers (notched).