Nurlink and Vidatronic Collaborate to Develop Low-Power IoT SoC

August 02, 2018 by Paul Shepard

Vidatronic, Inc. announced its collaboration with RF system-on-a-chip (SoC) design company Nurlink Technology to develop an unprecedented SoC solution built to power wireless communication systems for the Internet of Things (IoT).

The SoC will combine Vidatronic's patented power management unit (PMU) IP technology with Nurlink's advanced RF technology to create a solution that will advance the impact of IoT advancements in applications such as connected cars, smart homes, Artificial Intelligence (AI), robotics, and more.

Chengzhou Wang, CTO of Nurlink, stated: "It is our great pleasure to announce this partnership with Vidatronic. Their impressive IP portfolio and expertise in power management in advanced process nodes makes them the obvious partner to ensure our chip provides high-levels of performance while still maintaining superior power savings."

"We are delighted to announce Nurlink as a partner and licensee of our PMU IP," said Stephen Nolan, Vice President of Sales and Business Development at Vidatronic. "Nurlink is composed of an impressive team of wireless communication experts, and the next generation devices they are developing will rapidly accelerate the IoT market."

IoT SoC typical block diagram

Vidatronic's PMU combines several of the company's patented power management solutions into a single IP core that can be integrated alongside RF solutions in a wide array of consumer and IoT devices, including smartphones, tablets, and other wearables.