ITC Investigating Certain Semiconductor Integrated Circuits Using Tungsten Metallization & Related Products
The U.S. International Trade Commission (ITC) has voted to institute an investigation of certain semiconductor integrated circuits using tungsten metallization and products containing same. The products at issue in this investigation are semiconductor devices manufactured with tungsten metal.
The investigation is based on a complaint filed by LSI Corp. and Agere Systems Inc.. The complaint alleges violations of section 337 of the Tariff Act of 1930 in the importation into the United States of certain semiconductor integrated circuits using tungsten metallization and products containing same that infringe a patent owned by the complainants. The complainants requested that the ITC issue an exclusion order and a cease and desist order. LSI and Agere are seeking ITC orders to ban the importation of those infringing products into the US and to stop the companies alleged to infringe the patent from continuing their infringement acts.
Among the eighteen respondents the ITC has identified in the investigation are: United Microelectronics Corp. of Taiwan; Integrated Device Technology, Inc., of San Jose, California; AMIC Technology Corp. of Taiwan; Cypress Semiconductor Corp. of San Jose, California; Elpida Memory, Inc., of Japan; Freescale Semiconductor, Inc., of Austin, Texas; Microchip Technology, Inc., of Chandler, Arizona; Micronas Semiconductor Holding, AG, of Switzerland; National Semiconductor Corp. of Santa Clara, CA; NXP B.V. of the Netherlands; ON Semiconductor Corp. of Phoenix, AZ; Powerchip Semiconductor Corp., of Taiwan; STMicroelectronics NV of Switzerland; and Vanguard International Semiconductor Corp. of Taiwan.
