EV Group Establishes Heterogeneous Integration Competence Center
EV Group (EVG) has established the Heterogeneous Integration Competence Center™, which is designed to assist customers in leveraging EVG’s process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging. These include solutions and applications for high-performance computing and data centers, the Internet of Things (IoT), autonomous vehicles, medical and wearable devices, photonics and advanced sensors.
The Heterogeneous Integration (HI) Competence Center combines EVG’s world-class wafer bonding, thin-wafer handling, and lithography products and expertise, as well as pilot-line production facilities and services at its state-of-the-art cleanroom facilities at EVG’s headquarters in Austria, supported by EVG’s worldwide network of process technology teams.
Through the HI Competence Center, EVG will help customers to accelerate technology development, minimize risk, and develop differentiating technologies and products through heterogeneous integration and advanced packaging all while guaranteeing the highest IP protection standards that are required for working on pre-release products.
“Heterogeneous integration fuels new packaging architectures and demands new manufacturing technologies to support greater system and design flexibility, as well as increased performance and lower system design costs,” stated Markus Wimplinger, corporate technology development & IP director of EV Group.
“EVG’s new HI Competence Center provides an open access innovation incubator for our customers and partners across the microelectronics supply chain to collaborate while pooling our solutions and process technology resources to shorten development cycles and time to market for innovative devices and applications enabled by heterogeneous integration,” Wimplinger added.
EVG has an extensive background in heterogeneous integration, providing solutions for this key technology trend for more than 20 years. Among these are: permanent wafer bonding—including direct fusion and hybrid bonding for 3D packaging and metal bonding—and die-to-wafer bonding with and without collective carriers for integration of III-V compound semiconductors and silicon as well as high-density 3D packaging; temporary bonding and debonding, including mechanical, slide-off/lift-off, and UV laser assisted; thin-wafer handling; and innovative lithography technologies, including mask aligners, coaters and developers, and maskless exposure/digital lithography.