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Leclanché North America Opens Research and Manufacturing Facility

Leclanché North America Opens Research and Manufacturing Facility

News Aug 25, 2017 by Paul Shepard
Romeo Power Closes $30 Million Seed Financing; Ramps Battery Pack Production

Romeo Power Closes $30 Million Seed Financing; Ramps Battery Pack Production

News Aug 25, 2017 by Paul Shepard
Tie Down Looks for Liquid Cooling Growth with MaxQ Acquisition

Tie Down Looks for Liquid Cooling Growth with MaxQ Acquisition

News Aug 24, 2017 by Paul Shepard
Researchers Report Breakthrough in Magnesium Batteries

Researchers Report Breakthrough in Magnesium Batteries

News Aug 24, 2017 by Paul Shepard
ARPA-E Awards $30 Million for High-Performance WBG Power Converters

ARPA-E Awards $30 Million for High-Performance WBG Power Converters

News Aug 24, 2017 by Paul Shepard
Simplifying the Evaluation of AEC-Q100 Certified Voltage Regulators

Simplifying the Evaluation of AEC-Q100 Certified Voltage Regulators

News Aug 24, 2017 by Paul Shepard
SII Semiconductor Changes Name to ABLIC Inc.

SII Semiconductor Changes Name to ABLIC Inc.

News Aug 24, 2017 by Paul Shepard
Wireless System-On-Module for Android Things Designs

Wireless System-On-Module for Android Things Designs

News Aug 23, 2017 by Paul Shepard
Brite Semi and SaberTek Partner on Smart Utility Network Wireless Chip

Brite Semi and SaberTek Partner on Smart Utility Network Wireless Chip

News Aug 23, 2017 by Paul Shepard
60W Class-E Amplifier Dev Board with 200V GaN FET Enabling High Efficiency Up to 15MHz

60W Class-E Amplifier Dev Board with 200V GaN FET Enabling High Efficiency Up to 15MHz

News Aug 23, 2017 by Paul Shepard
Platform Supports High Load Current HVAC and Industrial Applications

Platform Supports High Load Current HVAC and Industrial Applications

News Aug 22, 2017 by Paul Shepard
Silego has Delivered More Than 3 Billion Configurable Mixed-Signal ICs

Silego has Delivered More Than 3 Billion Configurable Mixed-Signal ICs

News Aug 22, 2017 by Paul Shepard
Infineon adds DPAK Replacement SOT-223 Package Option for CoolMOS™ P7

Infineon adds DPAK Replacement SOT-223 Package Option for CoolMOS™ P7

News Aug 21, 2017 by Paul Shepard
Microchip Custom Programming Services now Include AVR® and SAM MCUs

Microchip Custom Programming Services now Include AVR® and SAM MCUs

News Aug 21, 2017 by Paul Shepard
U.S. Senate Considers Cybersecurity Improvement Act of 2017

U.S. Senate Considers Cybersecurity Improvement Act of 2017

News Aug 21, 2017 by Paul Shepard
Online Calculators for Thermistor Beta, Temp. Coefficient, and R-Temp

Online Calculators for Thermistor Beta, Temp. Coefficient, and R-Temp

News Aug 21, 2017 by Paul Shepard
Cadenza Teams with Syrah to Advance Graphite Anodes for Li-ion Batteries

Cadenza Teams with Syrah to Advance Graphite Anodes for Li-ion Batteries

News Aug 20, 2017 by Paul Shepard
Hyundai Mobis Develops Two-way Charger for EV, a Core Part for V2G

Hyundai Mobis Develops Two-way Charger for EV, a Core Part for V2G

News Aug 20, 2017 by Paul Shepard
Three-Stage Method could Revolutionize Zn-Air Recharging

Three-Stage Method could Revolutionize Zn-Air Recharging

News Aug 19, 2017 by Paul Shepard
S&C and Ameren Conduct Successful 24-Hour Islanding Test on Microgrid

S&C and Ameren Conduct Successful 24-Hour Islanding Test on Microgrid

News Aug 18, 2017 by Paul Shepard