News

Ansoft and Synopsys Join to Provide Co-Design/Analysis

June 02, 2004 by Jeff Shepard

Ansoft Corp. (Pittsburgh, PA) announced a collaboration with Synopsys Inc., which will provide streamlined IC and package co-design and analysis design flow solutions to address the substantial challenges of developing products based on 90 nm and System-on-Chip technologies.

"Integrated circuit packaging is now in the critical path of silicon product delivery as package I/O counts and densities continue to skyrocket. Increased functional integration, higher speed and lower power drive the requirements for today's high-performance IC packages," said Kevin Rinebold, senior technical marketing manager, Advanced Packaging Products at Synopsys. "Ansoft and Synopsys combine to provide a unique and automated package design and analysis solution to fill this evolving need."