New Industry Products

IRC Develops SOIC & SOT-23 Packaged Diode Arrays to Deliver IEC-compatible Transient Voltage Suppression

October 07, 2010 by Jeff Shepard

Providing design engineers with a compact means of protecting one to eight circuit traces against electrostatic discharge (ESD), lightning and other electrical fast transient (EFT) events, IRC, a TT electronics plc, company, has developed a comprehensive series of IEC-compatible TVS diode arrays in 8-, 14- or 16-pin SOIC-N and SOT-23 surface mount packages. Available in unidirectional and bidirectional versions, the diode arrays are capable of ESD protection of <40kV and carry a peak pulse power rating of 500W (tP = 8/20µs).

"The introduction of these TVS diode arrays gives communications design engineers a convenient method of protecting multiple circuit traces while maintaining signal integrity," explained Dr. Debasis Roy, Director of IRC’s Thin Film Business unit. "Our diode technology provides fast response times with low clamping and operating voltages; and they are available in unidirectional or bidirectional circuit configurations for protection of individual lines or up to eight circuit traces."

IRC’s QDN Series TVS diode arrays provide protection to IEC standards for a variety of transient voltage events, including: IEC 61000-4-2 - ESD protection to 15kV (air)/8kV (contact); IEC 61000-4-4 - EFT protection to 40A @ 5/50ns; and IEC 61000-4-5 - lightning/surge protection to 12A @ 8/20µs for Level 2 (line-to-ground) and Level 3 (line-to-line).

Specific applications for the TVS diode arrays include: low-voltage ASICs, wireless communications circuits in mobile phones and portable electronics; dataport protection for RS-422, RS-432 and RS-485 lines; Ethernet 10/100 Base-T and other LAN/WAN equipment; as well as communications circuits in desktop computers and other microprocessor based systems.

All devices in the QDN Series are ROHS-compliant and have an operating temperature range from -55 to +150°C. Packaging options include 7" and 13" reels as well as tube packaging for the SOIC devices.