Diodes, Inc. Announces Launch of Product Platform Featuring Increased Miniaturization and Efficiency

Diodes Inc. announced the introduction of its high-current density PowerDI™323 product platform with the release of new Schottky Rectifiers and Zener products. The PowerDI™323 product platform meets the growing demand for portability by providing smaller, more efficient discrete devices.

The PowerDI™323 is among the smallest power packages ever introduced in the power rectifier market. It features a footprint of 2.37mm2 and a profile height of 0.7mm, which is 33% lower than current products. Its flat heat sink provides optimal thermal contact and achieves best-in-class power performance. The internal lead frame of the PowerDI™323 is 150% larger than the standard SOD-323 and enables increased forward conduction current to pass through the die at a lower power consumption rate. Diodes' new PowerDI™323 PD3S Schottky Rectifiers are designed to improve efficiency and enable miniaturization of the dc-dc converters in small portable electronics, such as mobile phones, digital audio players and digital cameras.

"With the release of the new PowerDI™323 product platform, Diodes continues to extend its leadership position as an innovator in the discrete market," commented Mark King, Diodes' Sr. VP of Sales and Marketing. "The introduction ofthe PowerDI™323 product platform builds on the success of our innovative PowerDI product platform that was initiated with the popular PowerDI™5 and PowerDI™123 product lines. As a result of advance marketing efforts at selected key accounts, we have already received notice of our first PowerDI™323 design win into a next-generation digital audio player platform."

In addition, Diodes has extended the PowerDI™323 platform to the Zener market with the PD3Z284C series. The initial release of 5.1 to 12V Zener devices in this new efficient compact package is just the start, as Diodes prepares to roll out Zener devices in voltages that range from 2.4 up to 36V before the end of 2006. Diodes, Inc. plans to expand the package platform to include TVS devices as well as additional Schottky products by the end of this year.