TI Offers Products in New WCSP NanoStar Technology

October 13, 2003 by Jeff Shepard

Texas Instruments Inc. (TI, Dallas, TX) announced the delivery of select analog semiconductors in its NanoStar™ wafer chip-scale packaging (WCSP), which shrinks package size, increases design flexibility and improves reliability without sacrificing performance.

Unlike plastic packages, NanoStar has no molding compound, lead frame, wire bonds or leads. Using standard surface-mount technology assembly procedures, NanoStar can be mounted to a printed circuit board without additional under-fill. Other benefits include improved electrical performance, thinner package profile and high assembly yields.

The first power management ICs available in WCSP include the TPS793285, a 200mA radio frequency, low-dropout regulator, and the TPS62000 95% efficient dc/dc buck converter that supports a 2V to 5.5V input voltage and up to 600mA output current. The TPA2010D1 is a 2W, high-efficiency, filter-free, Class-D, audio power amplifier that requires only three external components. The TLV5614 is a quadruple, 12-bit, voltage-output, digital-to-analog converter with a flexible serial interface, allowing glueless interface to TMS320™, SPI™, QSPI™ and Microwire™ serial ports.

Also featuring the new WCSP is the OPA2347 dual operational amplifier featuring a speed/power ratio of 20µA of quiescent current/350kHz bandwidth), dc precision, low-voltage operation and rail-to-rail performance. The combination of low-power consumption and an eight-ball NanoStar package, which measures 1.008mm x 2.100mm, is perfect for a variety of battery-powered applications such as cell phones, pagers, cameras, PDAs, and remote sensors.