HDP User Group Launches New Revision of Board Mounted Power Supplies Guidelines
The High Density Packaging (HDP) User Group announced the launch of its second edition of Board Mounted Power Supply (BMPS) Application Guidelines. First, launched in March 2007, it was designed to support the communications and electronics manufacturing industry by promoting better understanding of BMPS products. Since then major users and manufacturers of BMPS products, have continued working to define the market’s requirements and understandings with respect to these products.
The new edition has significant improvements in areas such as Cooling, Digital Power, Energy efficiency, High Voltage Distribution, Lead-free Soldering, Point-of-Load, Remote Powering, and Total Cost of Ownership.
Contributors to the updated document include Agilent, Cisco, Alcatel-Lucent, Emerson, Ericsson, Flextronics, Infineon, International Rectifier, IPC, Linage Power, Murata Power Solutions, Netpower Labs, NetPower Technologies, Powerbrand Consulting, TDK-Lambda, Texas Instruments and Vicor Corporation. The document is endorsed by users and systems integrators including Alcatel-Lucent, Ericsson, Huawei, Juniper Networks, Nokia Siemens Networks, and supported by the Power Sources Manufacturers Association (PSMA) and the European Power Supply Manufacturers Association (EPSMA).
"The continued use of the BMPS Application Guidelines within our member companies helps to communicate, for example, reliability requirements and various impacts of design decisions. It also help designers and users of board mounted power supplies to better understand and use these products," said Marshall Andrews Executive Director of the HDP User Group. "This document is absolutely indispensable for anyone involved with BMPS.",
"Our goal with the document is to harmonize users’ and manufacturers’ views with respect to these products because many of today’s products are the result of successful product launches rather than the true user’s need" said Lars Thorsell, PowerBrand Consulting and initiator of the project, which was originally started at the Power Sources Manufacturers Association (PSMA) in 2002.
The 149-pages (A4 resp. 160-pages Letter) document is by far the most comprehensive of its kind, covering everything from basic topologies, power architectures, and reliability to today’s most topical issues, like digital power and energy savings. The BMPS Application Guidelines document is available from the HDP User Group offices and on the HDP User Group web site. It is free to members of HDP User Group and to contributing BMPS manufacturers, and will be priced at $350USD to the public. Members of EPSMA/PSMA will receive a 50% discount
