Ericsson and Texas Instruments Sign Joint Agreement

March 17, 2002 by Jeff Shepard

As an extension of a memorandum of understanding signed last September, Ericsson (Stockholm, Sweden) Mobile Platforms and Texas Instruments Inc. (Dallas, TX) have signed an agreement for GPRS and 3G reference design platforms based on TI's advanced silicon technology. Under the agreement, Texas Instruments will supply the core components for Ericsson's reference design solutions. Ericsson will offer third-generation mobile phone reference design platforms, including TI semiconductor solutions enabling wireless equipment manufacturers to bring their products to market faster and with reduced research and development investment.

"We are pleased to support Ericsson Mobile Platforms' solutions as a strategic TI-powered UMTS offering to the 3G market," said Gilles Delfassy, TI senior vice president and general manager for TI's Wireless Terminals Business Unit. “Working with Ericsson Mobile Platforms on the new reference designs extends our commitment to help wireless equipment manufacturers bring products to market quickly and easily."